
Test Sockets
Our sockets are designed around your application from the outset. We support any package type — SSOT6, SSOT23, TO263, PQFN, WLCSP, BGA, KGD and beyond — at any lead count and size, for any handler type, down to a minimum pitch of 0.2 mm.
Where a standard part cannot meet the mechanical or thermal requirement, we design one that can.
- Materials
- Vespel SP1 for high-performance fine-pitch applications · Torlon 5530 and ceramic for structural and thermal demand · PEEK for wear resistance · Semitron 520 and Krefine for ESD-sensitive devices · PEEK and ULTEM for cost-sensitive programmes
- Operating temperature
- −55 °C to +200 °C, with special spring technology for high-temperature and high-current environments
- Contact
- Single- and double-ended spring probe
- Contact materials
- Hardened BeCu, palladium alloy, and gold-plated brass
- Contact type
- Non-destructive
- Operating cycles
- Greater than 500,000 insertions
- Minimum pitch
- 0.2 mm
- Compliance
- RoHS
Manual Test Socket with PCB
We provide the complete hardware solution including lid assembly, socket assembly with pins, PCB design/fabrication, and mounting base.
Test Socket with Lid
We provide lid assembly and test socket with different types of contacts (Pogo Pins, Contact Fingers, Offset Probes, C-Pins, etc.).
Auto-Test Socket Assembly
We provide complete test socket assembly with pins and PCB design/fabrication.












